Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste

Essais d'environnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser

La CEI 60068-2-83:2011 fournit des méthodes d'enquêtes comparatives sur la mouillabilité des sorties métalliques ou métallisées des composants pour montage en surface (CMS) avec des pâtes à braser. Ces méthodes ne servent pas à fournir des données quantitatives absolues utilisées dans le cadre d'acceptions ou de rejets. NOTE: Différentes méthodes d'essai de brasabilité des composants pour montage en surface (CMS) sont décrites dans la CEI 60068-2-58 et dans la CEI 60068-2-69. La CEI 60068-2-58 prescrit une évaluation visuelle utilisant un bain de brasage et la méthode de refusion, la CEI 60068-2-69 prescrit une évaluation de balance de mouillage utilisant la méthode du bain de brasage et des gouttelettes de brasure.

Okoljsko preskušanje - 2-83. del: Preskusi - Preskus Tf: preskus spajkanja elektronskih komponent za površinsko montažo (SMD) z metodo za ugotavljanje omočljivosti z uporabo spajkalne paste

Ta del IEC 60068 podaja metode za primerjalno preučevanje omočljivosti kovinskih končnikov ali metaliziranih končnikov komponent za površinsko montažo (SMD) z uporabo spajkalnih past. Podatki, dobljeni s temi metodami, se ne uporabljajo kot absolutni kvantitativni podatki za namene preskusa uspešno - neuspešno.

General Information

Status
Published
Publication Date
13-Oct-2011
Withdrawal Date
11-Oct-2014
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available - Publishing
Start Date
14-Oct-2011
Completion Date
14-Oct-2011

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60068-2-83:2012
01-januar-2012
2NROMVNRSUHVNXãDQMHGHO3UHVNXVL3UHVNXV7ISUHVNXVVSDMNDQMD
HOHNWURQVNLKNRPSRQHQW]DSRYUãLQVNRPRQWDåR 60' ]PHWRGR]DXJRWDYOMDQMH
RPRþOMLYRVWL]XSRUDERVSDMNDOQHSDVWH
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method using
solder paste
Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
unter Verwendung von Lotpaste
Essais d'environnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilité des
composants électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser
Ta slovenski standard je istoveten z: EN 60068-2-83:2011
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN 60068-2-83:2012 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 60068-2-83:2012

---------------------- Page: 2 ----------------------

SIST EN 60068-2-83:2012

EUROPEAN STANDARD
EN 60068-2-83

NORME EUROPÉENNE
October 2011
EUROPÄISCHE NORM

ICS 19.040; 31.190


English version


Environmental testing -
Part 2-83: Tests -
Test Tf: Solderability testing of electronic components for surface
mounting devices (SMD) by the wetting balance method using solder
paste
(IEC 60068-2-83:2011)


Essais d'environnement -  Umweltprüfungen -
Partie 2-83: Essais - Teil 2-83: Prüfungen -
Essais Tf: Essai de brasabilité des Prüfung Tf: Prüfung der Lötbarkeit von
composants électroniques pour les Bauelementen der Elektronik für
composants pour montage en surface Oberflächenmontage (SMD) mit der
(CMS) par la méthode de la balance de Benetzungswaage unter Verwendung von
mouillage utilisant de la pâte à braser Lotpaste
(CEI 60068-2-83:2011) (IEC 60068-2-83:2011)



This European Standard was approved by CENELEC on 2011-10-12. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-83:2011 E

---------------------- Page: 3 ----------------------

SIST EN 60068-2-83:2012
EN 60068-2-83:2011 - 2 -
Foreword
The text of document 91/975/FDIS, future edition 1 of IEC 60068-2-83, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60068-2-83:2011.

The following dates are fixed:
(dop) 2012-07-12
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2014-10-12
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 60068-2-83:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-69 NOTE  Harmonized as EN 60068-2-69.
IEC 61189-5 NOTE  Harmonized as EN 61189-5.

---------------------- Page: 4 -----
...

SLOVENSKI STANDARD
kSIST FprEN 60068-2-83:2010
01-februar-2010
2NROMVNRSUHVNXãDQMHGHO3UHVNXVL3UHVNXV7I3UHVNXVVSDMNDQMD
HOHNWURQVNLKNRPSRQHQW]DSRYUãLQVNRPRQWDåR 60' ]PHWRGR]DGRORþDQMH
RPRþOMLYRVWL]XSRUDERVSDMNDOQHSDVWH
Environmental testing -- Part 2-83: Tests - Test Tf: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method using
solder paste
Ta slovenski standard je istoveten z: FprEN 60068-2-83:2009
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.020 Elektronske komponente na Electronic components in
splošno general
kSIST FprEN 60068-2-83:2010 en,fr
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
kSIST FprEN 60068-2-83:2010

---------------------- Page: 2 ----------------------
kSIST FprEN 60068-2-83:2010

91/903/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
®
PROJET DE COMITÉ POUR VOTE (CDV)
Project number IEC 60068-2-83, Ed.1
Numéro de projet
IEC/TC or SC: Secretariat / Secrétariat
TC91
JAPAN
CEI/CE ou SC:

Date of circulation Closing date for voting (Voting
Submitted for parallel voting in
Date de diffusion mandatory for P-members)
CENELEC
Date de clôture du vote (Vote
 2009-11-20
obligatoire pour les membres (P))
Soumis au vote parallèle au
CENELEC
2010-04-23
Also of interest to the following committees Supersedes document
Intéresse également les comités suivants Remplace le document
IEC SC23J, TC40, TC47, SC47D, SC48B, TC51 91/846/CD - 91/875/CC
Proposed horizontal standard
Norme horizontale suggérée
Other TC/SCs are requested to indicate their interest, if any, in this CDV to the TC/SC secretary
    Les autres CE/SC sont requis d’indiquer leur intérêt, si nécessaire, dans ce CDV à l’intention du secrétaire du CE/SC
Functions concerned
Fonctions concernées
Safety EMC Environment Quality assurance
Sécurité
CEM Environnement Assurance qualité
CE DOCUMENT EST TOUJOURS À L'ÉTUDE ET SUSCEPTIBLE DE THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT
MODIFICATION. IL NE PEUT SERVIR DE RÉFÉRENCE. SHOULD NOT BE USED FOR REFERENCE PURPOSES.
LES RÉCIPIENDAIRES DU PRÉSENT DOCUMENT SONT INVITÉS À RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR
PRÉSENTER, AVEC LEURS OBSERVATIONS, LA NOTIFICATION DES COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT RIGHTS OF
DROITS DE PROPRIÉTÉ DONT ILS AURAIENT ÉVENTUELLEMENT WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING
CONNAISSANCE ET À FOURNIR UNE DOCUMENTATION EXPLICATIVE. DOCUMENTATION.

Titre :    Title : IEC 60068-2-83 Ed.1.0: Environmental
Testing - Part 2-83: Tests-test Tf: Solderability

testing of electronic components for surface
mounting devices (SMD) by the wetting balance
method using solder paste


Note d'introduction Introductory note
The title of the document had been changed to

delete the words “lead free”, during the
preparation stage of CD. The original proposed
scope was to use “lead free solder paste” but
not limited to it.

The statement on the patent rights is still
pending from patent holders.

ATTENTION ATTENTION
VOTE PARALLÈLE IEC – CENELEC
CEI – CENELEC PARALLEL VOTING
L’attention des Comités nationaux de la CEI, membres du The attention of IEC National Committees, members of
CENELEC, est attirée sur le fait que ce projet de comité CENELEC, is drawn to the fact that this Committee Draft for
pour vote (CDV) de Norme internationale est soumis au Vote (CDV) for an International Standard is submitted for
vote parallèle. parallel voting.
Les membres du CENELEC sont invités à voter via le The CENELEC members are invited to vote through the
système de vote en ligne du CENELEC. CENELEC online voting system.

Copyright © 2009 International Electrotechnical Commission, IEC. All rights reserved. It is
permitted to download this electronic file, to make a copy and to print out the content for the sole
purpose of preparing National Committee positions. You may not copy or "mirror" the file or
printed version of the document, or any part of it, for any other purpose without permission in
writing from IEC.
FORM CDV (IEC)
® Registered trademark of the International Electrotechnical Commission
2009-01-09

---------------------- Page: 3 ----------------------
kSIST FprEN 60068-2-83:2010
91/903/CDV
IEC 60068-2-83 Ed.1 – 1 –
CONTENTS

1 Scope .5
2 Normative references .5
3 Terms and definitions .5
4 Test .
...

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