IEC 61249-2-51:2023

IEC 61249-2-51
®

Edition 1.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Materials for printed boards and other interconnecting structures –
Part 2-51: Reinforced base materials, clad and unclad – Base materials for
integrated circuit card carrier tape, unclad

Matériaux pour circuits imprimés et autres structures d’interconnexion –
Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués – Matériaux de
base pour bande support de carte à circuit intégré, non plaqués

IEC 61249-2-51:2023-05(en-fr)

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IEC 61249-2-51

®


Edition 1.0 2023-05




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE











Materials for printed boards and other interconnecting structures –

Part 2-51: Reinforced base materials, clad and unclad – Base materials for

integrated circuit card carrier tape, unclad



Matériaux pour circuits imprimés et autres structures d’interconnexion –

Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués – Matériaux de


base pour bande support de carte à circuit intégré, non plaqués













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-6969-5




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – IEC 61249-2-51:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Construction and materials . 7
4.1 Construction . 7
4.2 Epoxide woven E-glass underlayer . 7
4.3 Adhesive . 7
4.4 Release film . 7
5 Electrical properties . 7
6 Non-electrical properties . 8
6.1 Appearance of the IC carrier tape base materials . 8
6.1.1 Delamination . 8
6.1.2 Colloidal particles and metallic particles in underlayer . 8
6.1.3 Colloidal particles in adhesive layer . 8
6.1.4 Scratches of adhesive . 8
6.1.5 Bubbles in underlayer . 8
6.1.6 Breakages and exposures of reinforcement fibre in underlayer . 8
6.2 Dimensional of IC carrier tape base materials . 8
6.2.1 Length and width . 8
6.2.2 Thickness of underlayer . 8
6.2.3 Thickness of adhesive layer . 8
6.3 Splices . 8
6.4 Glass transition temperature . 9
6.5 Surface properties of the underlayer side . 9
6.6 Tensile strength and elongation at break . 9
6.7 Water absorption . 9
6.8 Peel strength . 10
6.9 Resin flow . 10
7 Quality assurance . 10
7.1 Quality system . 10
7.2 Responsibility for inspection . 10
7.3 Positions of specimens on the sample . 10
7.4 Qualification inspection . 11
7.4.1 General . 11
7.4.2 Samples . 11
7.4.3 Frequency . 11
7.4.4 Criterion rule . 11
7.5 Quality conformance inspection . 12
7.5.1 General . 12
7.5.2 Inspection lot . 12
7.5.3 Group A inspection . 12
7.5.4 Group B inspection . 12
7.5.5 Group C inspection . 12
7.5.6 Criterion rule . 12
7.5.7 Rejected lots . 12

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IEC 61249-2-51:2023 © IEC 2023 – 3 –
7.6 Certificate of conformance . 12
7.7 Safety data sheet . 12
8 Packaging, marking and storage . 13
8.1 Packaging, marking . 13
8.2 Storage, storage condition and shelf life . 13
Annex A (normative) Requirements for the preparation of samples of some
performance items . 14
A.1 Ordering information . 14
Annex B (informative) Engineering information . 15
B.1 General . 15
B.2 Chemical properties . 15
B.3 Electrical properties . 15
B.4 Mechanical properties . 15
B.5 Physical properties . 15
B.6 Thermal properties . 15
Bibliography . 16

Figure 1 – Construction of IC carrier tape base materials . 7

Table 1 – Electrical properties . 7
Table 2 – Glass transition temperature of underlayer . 9
Table 3 – roughness, glossiness(60°) and surface energy. 9
Table 4 – Tensile strength and elongation at break . 9
Table 5 – Water absorption . 9
Table 6 – Peel strength . 10
Table 7 – Resin flow . 10
Table 8 – Qualification and conformance inspection . 11
Table A.1 – Requirements for the preparation of samples of some performance items . 14

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– 4 – IEC 61249-2-51:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

MATERIALS FOR PRINTED BOARDS AND
OTHER INTERCONNECTING STRUCTURES –

Part 2-51: Reinforced base materials clad and unclad – Base
materials for integrated circuit card carrier tape, unclad

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61249-2-51 has been prepared by IEC technical committee 91, Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1847/FDIS 91/1865/RVD

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

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IEC 61249-2-51:2023 © IEC 2023 – 5 –
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 61249 series, published under the general title Materials for printed
boards and other interconnecting structures, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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– 6 – IEC 61249-2-51:2023 © IEC 2023
MATERIALS FOR PRINTED BOARDS AND
OTHER INTERCONNECTING STRUCTURES –

Part 2-51: Reinforced base materials clad and unclad – Base
materials for integrated circuit card carrier tape, unclad



1 Scope
This part of IEC 61249 specifies the construction, materials, property requirements, quality
assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape,
unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material,
one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with
adhesive and protected by release film.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61189-2:2006, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 2: Test methods for materials and other
interconnection structures
IEC PAS 61249-6-3, Specification for finished fabric woven from "E" glass for printed boards
ISO 2813, Paints and varnishes – Determination of gloss value at 20°, 60° and 85°
ISO 8296, Plastics – Film and sheeting – Determination of wetting tension
ISO 11014:2009, Safety data sheet for chemical products – Content and order of sections
ISO 21920-2, Geometrical product specifications (GPS) – Surface texture: Profile – Part 2:
Terms, definitions and surface texture parameters
ASTM D882, Standard Test Method for Tensile Properties of Thin Plastic Sheeting
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp

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IEC 61249-2-51:2023 © IEC 2023 – 7 –
3.1
IC carrier tape base materials
base materials to manufacture the integrated circuit card carrier tape
4 Construction and materials
4.1 Construction
The construction of IC carrier tape base materials is as follows:

Figure 1 – Construction of IC carrier tape base materials
4.2 Epoxide woven E-glass underlayer
The epoxide woven E-glass underlayer (hereinafter referred to as underlayer) is E-glass
reinforcement. The underlayer is fully cured, and the glass transition temperature of the
underlayer shall be 150 °C minimum.
The woven E-glass used in underlayer shall meet the requirements specified in
IEC PAS 61249-6-3.
4.3 Adhesive
Adhesive can be epoxy adhesive or acrylic adhesive, epoxy is preferred. The peel strength
should meet the requirements in 6.8.
4.4 Release film
Release film is used to protect the adhesive, it can be released easily before use, and does not
destroy the adhesive.
5 Electrical properties
The electrical properties requirements are shown in Table 1. The requirements for the
preparation of samples shall be in accordance with Annex A.
Table 1 – Electrical properties
Performance items Units Test method Requirement
Surface resistivity after damp heat while in the humidity
5
MΩ IEC 61189-2 2E04
≥10
chamber
Volume resistivity after damp heat while in the humidity
6
MΩ·m IEC 61189-2 2E04
≥10
chamber
4
Surface resistivity after E-24/125 while in the chamber MΩ IEC 61189-2 2E04
≥10
5
Volume resistivity after E-24/125 while in the chamber MΩ·m IEC 61189-2 2E04 ≥10
Electric strength kV/mm IEC 61189-2 2E02 ≥20

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– 8 – IEC 61249-2-51:2023 © IEC 2023
6 Non-electrical properties
6.1 Appearance of the IC carrier tape base materials
6.1.1 Delamination
The adhesive should not be separated from the underlayer.
6.1.2 Colloidal particles and metallic particles in underlayer
The plan view size of colloidal particles in underlayer shall be not greater than 2,0 mm. The
plan view size greater than 0,5 mm and less than or equal to 2,0 mm shall be no more than
4 per 30 cm roll length. The plan view size less than or equal to 0,5 mm shall not be counted.
Encapsulated metallic particles are not allowed.
6.1.3 Colloidal particles in adhesive layer
The plan view size of colloidal particles in adhesive layer shall not greater than 2,0 mm, the
plan view size greater than 0,5 mm and less than or equal to 2,0 mm shall no more than 4 per
30 cm roll length, the plan view size less than or equal to 0,5 mm shall not be counted.
6.1.4 Scratches of adhesive
The adhesive layer should not be scratched.
6.1.5 Bubbles in underlayer
The bubbles in underlayer shall be less than or equal to 200 µm in length and shall not occur
in bubble clusters any more than three bubbles in a 3,2 mm diameter circle.
6.1.6 Breakages and exposures of reinforcement fibre in underlayer
There are no breakages and exposures of reinforcement fibre in underlayer.
6.2 Dimensional of IC carrier tape base materials
6.2.1 Length and width
The length and the width of the sheet shall be as agreed between user and supplier (AABUS).
+5
The tolerance of length shall be within m and the tolerance of width shall be within ±0,1 mm.
0
6.2.2 Thickness of underlayer
The nominal thickness of underlayer shall be AABUS, the tolerance shall be within ±10 % of
the value specified.
6.2.3 Thickness of adhesive layer
The nominal thickness of adhesive layer shall be AABUS, the tolerance shall be within ±10 %
of the value specified.
6.3 Splices
The number of splices (including splicing tape and marking, the same below) is less than or
equal to 2 per 160 m, and the splices gap is less than or equal to 50 µm.
Splicing tape should be evenly pasted on both sides of the IC carrier tape base materials, and
should be pasted extend to the edge of the IC carrier tape base materials and ensure that the
edge is orderliness, and should not be folded.

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IEC 61249-2-51:2023 © IEC 2023 – 9 –
6.4 Glass transition temperature
The requirements of glass transition temperature for the underlayer of the IC carrier tape base
materials shall be as shown in Table 2.
Table 2 – Glass transition temperature of underlayer
Performance items Units Test method Requirement
Glass transition temperature (Tg) °C IEC 61189-2 2M10 ≥150

6.5 Surface properties of the underlayer side
The surface properties of the underlayer side include roughness, glossiness (60°) and surface
energy, and the requirements shall be as shown in Table 3.
Table 3 – roughness, glossiness(60°) and surface energy
Performance items Test methods Requirements
Roughness ISO 21920-2 3 µm ≤ Rz ≤ 15 µm
Glossiness(60°) ISO 2813 < 5,0 GU
Surface energy ISO 8296 72 mN/m Ink tested qualified

6.6 Tensile strength and elongation at break
When the IC carrier tape base materials are tested in accordance with test method ASTM D882,
the requirements of tensile strength and elongation at break shall be as shown in Table 4,
applicable to underlayer of IC carrier tape base materials with a thickness greater than or equal
to 90 µm. The requirements for the preparation of samples shall be in accordance with Annex A.
Table 4 – Tensile strength and elongation at break
Performance items Units Test method Requirement
≥200 (Length)
Tensile strength Mpa ASTM D882
≥150 (Cross)
≥1,5 (Length)
Elongation at break % ASTM D882
≥1,0 (Cross)

6.7 Water absorption
When the IC carrier tape base materials is tested in accordance with test method 2N02 of
IEC 61189-2, the maximum water absorption shall be as shown in Table 5. The requirements
for the preparation of samples shall be in accordance with Annex A.
Table 5 – Water absorption
Performance items Units Test method Requirement
Water absorption % IEC 61189-2 2N02 ≤1,0

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– 10 – IEC 61249-2-51:2023 © IEC 2023
6.8 Peel strength
The samples are prepared as follows: Sticking the matte side of 35 µm electrodeposited copper
foil on the adhesive side of IC carrier tape base materials after release film removal. Then totally
cured by heating (laminate 5 s ± 1 s at 180 °C ± 2 °C temperature and 0,5 MPa pressure, then
baking 60 min ± 1 min at 160 °C ± 2 °C in oven), After removal from the oven, the samples shall
be cooled to room temperature in a desiccator or a drying cabinet before making specimens,
then prepare specimens in accordance with IEC 61189-2 2M13. The requirements of peel
strength shall be as shown in Table 6.
Table 6 – Peel strength
Performance items Test methods Requirements
Peel strength as received IEC 61189-2 2M13 ≥ 1 N/mm
Peel strength after 103,4 kPa
IEC 61189-2 2M13
≥ 20% of Peel strength as received
pressure vessel conditioning, 24 h

6.9 Resin flow
The requirements of Resin flow shall be as shown in Table 7.
Table 7 – Resin flow
Performance items Test methods Requirements
a
Resin flow Laminate method < 0,2 mm
a
 Laminate method to measure resin flow procedure is as follows:
– punch several holes (one hole of a diameter of 6,4 mm and two holes of a diameter of 4,8 mm, 3,2 mm and
1,6 mm) on the IC carrier tape base materials;
– remove the release film;
– laminate the adhesive side wi
...